584 Search Results for "silicon"
Tell Us About Yourself! | Altium
We hear from lots of you everyday - engineers buyers part suppliers makers software developers - and are grateful for all the feedback. We'd love to hear from more of you! If you have a moment please ...
Verified Manufacturer Program, Ecliptek Corporation | Altium
Octopart users want to access to the most accurate and complete component information available and they want it now. To that end we're happy to announce the Verified Manufacturer Program which allows ...
PCB Design Resources and Information | Altium
Explore our resources to expand your skills in PCB development and stay up to date with the latest technologies and best practices.
What to Spec Around Wide-Bandgap Switches
Define the right specs for SiC and GaN power stages. Learn how to control switching behavior isolation sensing magnetics and layout for a clean first spin.
On Data | Altium
At the heart of Octopart is our large and growing part database. Since we launched Octopart just over a year ago our database has grown steadily - we started with part data from 4 distributors - now w ...
Partlist Rewrite | Altium
Over the course of the last few months we've been working hard on rewriting much of the site. This rewrite will allow us to develop features more quickly and robustly. The first round of the rewrite h ...
Removing Microplastics from Water: PolyGone's Revolutionary Solution
Discover a breakthrough in microplastic removal. PolyGone’s hydrophobic silicon filters trap particles passively. Scalable for plants stormwater and reservoirs.
One Year Old!! | Altium
What Is Allocation in the Semiconductor Industry? From silicon ... Silicon ...
GreenPAK vs FPGA vs CPLD: Which Is Right for Your Design?
Programmable logic devices offer a fast way to create a processor or ASIC. But if you need mixed-signal capabilities there's only one choice that makes sense: GreenPAK from Renesas.
Wire Bonding: Modern Applications, Technology Trends and Cost Considerations | Altium
Introduction Wire bonding has long been the dominant method for connecting semiconductor dies to package lead frames and circuit boards particularly in Chip-on-Board (COB) technology where the die is ...