BGA (Ball Grid Array) device packaging for embedded PCB design has significantly evolved over the years making it difficult to keep up with the technology and poses a number of challenges due to multiple exit routes. Altium Designer 18 uses some strategies to successfully overcome these BGA design challenges.
Altium Designer 18 has developed strategies that define suitable exit routes that won’t cause fabrication failures or other issues, and determine the required layers. Designing a BGA is not an easy task because it requires a number of design rule checks to ensure proper width spacing for all traces and well as determination on how many layers are needed in order for the design to be productive. Altium Designer can help you with this technology.
Develop your electronic product under the wing of Altium Designer with the following benefits:
Up-to-date and cutting edge PCB technology delivered with easy-to-use design tools
A single-priced license to develop your idea from concept to manufacturing
Over 30 years of PCB design research, experience, and development
Altium Designer 18 can help bring your idea to reality. Download your FREE trial today.