KB：沉积铜盗取图案以实现均匀的镀层分布

Solution Details

Unfortunately, there is no straightforward command/feature in one go to achieve copper thieving currently.  There is a workaround identified to leverage Via Stitching feature to realize a thieving pattern.

1  Copy the poured polygon, which you want to thieve, to somewhere outside the board
2  Place another copper fill over, so you have something to stitch against
3  Apply via stitching to populate an array of vias within the polygon shape
4  Tools » Convert » Convert Selected Vias to Free Pads to covert the via array to free pads.

For a visual aid, please refer videos here:
https://www.youtube.com/watch?v=Ca2rFu2zW_k
https://www.youtube.com/watch?v=6RsW8ehU_lI