KB: 均一なめっき分布を達成するために、銅の盗難パターンを堆積させます

Altium Designer Altium Designer
銅の盗用は、製造業者による均一なめっき分布を達成するために、最も外側の層で必要または望ましい場合があります。残念ながら、現在、銅の盗用を一度に実現する直接的なコマンド/機能はありませんが、盗用パターンを実現するためにVia Stitching機能を活用する回避策が特定されています。

Solution Details

Unfortunately, there is no straightforward command/feature in one go to achieve copper thieving currently.  There is a workaround identified to leverage Via Stitching feature to realize a thieving pattern.

Copy the poured polygon, which you want to thieve, to somewhere outside the board
2  Place another copper fill over, so you have something to stitch against
3  Apply via stitching to populate an array of vias within the polygon shape
4  Tools » Convert » Convert Selected Vias to Free Pads to covert the via array to free pads.

For a visual aid, please refer videos here:
https://www.youtube.com/watch?v=Ca2rFu2zW_k
https://www.youtube.com/watch?v=6RsW8ehU_lI

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