KB: 균일한 도금 분포를 달성하기 위해 구리 도둑 패턴을 증착하세요
Updated: January 23, 2025
Altium Designer
구리 도둑질은 제작자가 균일한 도금 분포를 달성하기 위해 가장 바깥쪽 층에서 필요하거나 원하는 경우가 있습니다. 불행히도 현재 구리 도둑질을 한 번에 달성하기 위한 직접적인 명령/기능은 없지만, 도둑질 패턴을 실현하기 위해 Via Stitching 기능을 활용하는 우회 방법이 확인되었습니다.
개요
Copper thieving may be requrired or desired on the outermost layers to achieve uniform plating distribution by a fabricator. Unfortunately, there is no straightforward command/feature in one go to achieve copper theving currently, but there is a workaround identified to leverage Via Stitching feature to realize a thieving pattern.
Solution Details
Unfortunately, there is no straightforward command/feature in one go to achieve copper thieving currently. There is a workaround identified to leverage Via Stitching feature to realize a thieving pattern.
1 Copy the poured polygon, which you want to thieve, to somewhere outside the board
2 Place another copper fill over, so you have something to stitch against
3 Apply via stitching to populate an array of vias within the polygon shape
4 Tools » Convert » Convert Selected Vias to Free Pads to covert the via array to free pads.
For a visual aid, please refer videos here:
https://www.youtube.com/watch?v=Ca2rFu2zW_k
https://www.youtube.com/watch?v=6RsW8ehU_lI