フットプリントウィザード

Ball Grid Arrays (BGA)

To change the pads' diameters, click on the value and enter the new value.

To change the pad to pad distances, click on the values and enter the new value.

To change the outline width, click on the value and enter the new value.

Use the drop-down to select either Alpha Numeric or Numeric naming style.

Use the up and down arrows in each region to define the footprint value for Cutout, Center, Rows and columns, and Corner.

Capacitors

Use the drop-down to select the type of capacitor you want to design. Choose from Through Hole or Surface Mount.

To change the pads' dimensions, click on the values and enter the new values.

To change the pads positioning, click on the value and enter the new value.

Use the drop-down to select the capacitor's polarity, either Not Polarised or Polarised. Use the drop-down to select the capacitor's mounting style, either Axial or Radial.

Use the drop-down to select outline type, either Non polarised Outline or Polarised Outline. 

To change the outline dimensions, click on the values and enter the new values.

Diodes

Use the drop-down to select the type of diode you want to design. Choose from Through Hole or Surface Mount.

To change the pads' dimensions, click on the values and enter the new values.

To change the pads positioning, click on the value and enter the new value.

To change the outline dimensions, click on the value and enter the new value.

Dual In-line Packages (DIP)

To change the pads' dimensions, click on the value and enter the new required value.

To change the pads' layout, click on the value and enter the new required value.

To change the outline width, click on the value and enter the new required value.

Use the up and down arrows to select the total number of pads.

Edge Connectors

To change the pads' dimensions, click on the value and enter the new required value.

To change the pad to pad distance, click on the value and enter the new required value.

Use the up and down arrows to select the number of pads. Click the green arrow to change the naming order. The arrow will dynamically change to display the order.

Leadless Chip Carriers (LCC)

To change the pads' dimensions, click on the value and enter the new required value.

Use the drop-down to choose the pads' shapes. Select from Round or Rectangular for For the first pad, then select Round or Rectangular for For the other pads.

To change the outline width, click on the value and enter the new required value.

To change the pads' positioning, click on the value and enter the new required value.

Click one of the radio buttons to select the first pad's location. Choose the naming direction by clicking on the green arrow. The arrow will dynamically update to display the order.

Use the up and down arrows to select the number of pads for both X and Y.

Pin Grid Arrays (PGA)

To change the pads' dimensions, click on the value and enter the new required value.

To change the pad to pad distances, click on the value and enter the new required value.

To change the outline width, click on the value and enter the new required value.

Use the drop-down to select the pads naming style, either Alpha Numeric or Numeric.

Use the up and down arrows in each region to define the footprint value for Cutout, Center, Rows and columns, and Corner.

Quad Packs (QUAD)

To change the pads' dimensions, click on the value and enter the new required value.

Use the drop-down to choose the pads' shapes. Select from Round or Rectangular for For the first pad, then select Round or Rectangular for For the other pads.

To change the outline width, click on the value and enter the new required value.

To change the pads' positioning, click on the value and enter the new required value.

Click one of the radio buttons to select the first pad's location. Choose the naming direction by clicking on the green arrow. The arrow will dynamically update to display the order.

Use the up and down arrows to select the number of pads for both X and Y.

Resistors

Defining the Board Technology

Select the type of resistor you want to design from the drop-down. Choices include Through Hole or Surface Mount.

Defining the Pads Dimensions

To change the pads' dimensions, click on the value and enter the new value.

To change the pad to pad distance, click on the value and enter the new value.

To change the outline dimensions, click on the value and enter the new value.

Small Outline Packages (SOP)

To change the pads' dimensions, click on the value and enter the new value.

To change the pad to pad distance, click on the value and enter the new value.

To change the outline width, click on the value and enter the new value.

Use the up and down arrows to select the total number of pads.

Staggered Ball Grid Arrays (SBGA)

To change the pads' dimensions, click on the value and enter the new value.

To change the pad to pad distance, click on the value and enter the new value.

To change the outline width, click on the value and enter the new value.

Use the drop-down to select the pads naming style, either Alpha Numeric or Numeric.

Use the up and down arrows in each region to define the footprint value for Cutout, Center, Rows and columns, and Corner.

Staggered Pin Grid Arrays (SPGA)

To change the pads' dimensions, click on the value and enter the new value.

To change the pad to pad distance, click on the value and enter the new value.

To change the outline width, click on the value and enter the new value.

Use the drop-down to select the pads' naming style, either Alpha Numeric or Numeric.

Use the up and down arrows in each region to define the footprint value for Cutout, Center, Rows and columns, and Corner.