摘要
返回所有 Object Kind 属性与指定对象类型匹配的对象。
语法
IsObjectKind(ObjectType : String) : Boolean/Boolean_String
ObjectType 指定对象种类,且必须是以下字符串之一:
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Design Objects – '3D Body'、'Arc'、 'Angular Dimension'、 'Baseline Dimension'、'Center Dimension'、 'Component'、 'Coordinate'、 'Datum Dimension'、 'Design View'、 'Drill Table'、'Embedded Board'、'Fill'、 'Layer Stack Table'、 'Leader Dimension'、 'Linear Diameter Dimension'、 'Linear Dimension'、 'OLE Object'、'Original Dimension'、'Pad'、'Poly'、'Radial Diameter Dimension'、'Radial Dimension'、'Region'、'Split Plane'、'Text'、'Track'、'Via'。
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Design Rules – 以下字符串用于定位各种规则类型。规则类型(如其在 PCB Rules and Constraints Editor 对话框中显示)会在字符串后以括号标出:
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'Acute Angle Rule'(锐角)
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'Bare-board Fabrication Test Point Style Rule'(制造测试点样式)
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'Bare-board Fabrication Test Point Usage Rule'(制造测试点用途)
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'Board Outline Clearance'(板外形间隙)
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'Broken Nets Rule'(未布线网络)
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'Clearance Rule'(间隙)
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'Component Clearance Rule'(元件间隙)
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'Component Rotations Rule'(元件方向)
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'Confinement Constraint Rule'(房间定义)
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'Daisy Chain Stub Length Rule'(菊链支线长度)
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'Differential Pairs Rule'(差分对布线)
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'Fanout Control Rule'(扇出控制)
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'Flight Time Falling Edge Rule'(飞行时间 - 下降沿)
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'Flight Time Rising Edge Rule'(飞行时间 - 上升沿)
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'Hole To Hole Clearance Rule'(孔到孔间隙)
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'In-circuit Assembly Test Point Style Rule'(装配测试点样式)
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'In-circuit Assembly Test Point Usage Rule'(装配测试点用途)
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'Layer Pair Rule'(层对)
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'Matched Lengths Rule'(长度匹配)
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'Max Min Height Rule'(高度)
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'Max Min Hole Size Rule'(孔尺寸)
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'Max Min Impedance Rule'(阻抗)
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'Max Min Length Rule'(长度)
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'Max Min Width Rule'(宽度)
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'Max Slope Falling Edge Rule'(斜率 - 下降沿)
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'Max Slope Rising Edge Rule'(斜率 - 上升沿)
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'Max Via Stub Length (BackDrilling rule)'(最大过孔残桩长度(背钻))
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'Maximum Via Count Rule'(最大过孔数量)
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'Minimum Annular Ring Rule'(最小环宽)
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'Minimum Solder Mask Sliver Rule'(最小阻焊桥)
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'Modified Polygon'(修改后的多边形)
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'Net Antennae Rule'(网络天线效应)
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'Nets To Ignore Rule'(忽略的网络)
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'Overshoot Falling Edge Rule'(过冲 - 下降沿)
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'Overshoot Rising Edge Rule'(过冲 - 上升沿)
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'Parallel Segment Rule'(平行线段)
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'Paste Mask Expansion Rule'(钢网扩展)
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'Permitted Layers Rule'(允许的层)
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'Polygon Connect Style Rule'(多边形连接样式)
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'Power Plane Clearance Rule'(电源平面间隙)
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'Power Plane Connect Style Rule'(电源平面连接样式)
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'Routing Corner Style Rule'(布线拐角)
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'Routing Layers Rule'(布线层)
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'Routing Priority Rule'(布线优先级)
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'Routing Topology Rule'(布线拓扑)
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'Routing Via Style Rule'(布线过孔样式)
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'Short Circuit Rule'(短路)
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'Signal Base Value Rule'(信号基值)
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'Signal Stimulus Rule'(信号激励)
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'Signal Top Value Rule'(信号顶值)
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'Silk To Silk Clearance Rule'(丝印到丝印间隙)
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'Silk To Solder Mask Clearance Rule'(丝印到阻焊间隙)
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'SMD Entry'(SMD 进入)
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'SMD Neck Down Rule'(SMD 缩颈)
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'SMD To Corner Rule'(SMD 到拐角)
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'SMD To Plane Rule'(SMD 到平面)
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'Solder Mask Expansion Rule'(阻焊扩展)
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'Supply Nets Rule'(供电网络)
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'Unconnected Pin Rule'(未连接引脚)
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'Undershoot Falling Edge Rule'(欠冲 - 下降沿)
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'Undershoot Rising Edge Rule'(欠冲 - 上升沿)
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'Vias Under SMD Rule'(SMD 下方过孔)
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Others – 'Board Region'、'Class'、'Differential Pair'、'Net'、'Violation'。
使用示例
IsObjectKind('Via')
IsObjectKind('Via') = True
IsObjectKind('Via') = 'True'
返回所有过孔对象。
Not IsObjectKind('Track')
IsObjectKind('Track') = False
IsObjectKind('Track') = 'False'
返回所有对象 except 走线对象。
注释
ObjectType 字符串开头和结尾处的单引号字符 (') 为必需。