概要
Object Kind プロパティが指定したオブジェクト種別に一致する、すべてのオブジェクトを返します。
構文
IsObjectKind(ObjectType : String) : Boolean/Boolean_String
ObjectType はオブジェクト種別を指定し、次のいずれかの文字列でなければなりません：
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Design Objects – '3D Body', 'Arc', 'Angular Dimension', 'Baseline Dimension', 'Center Dimension', 'Component', 'Coordinate', 'Datum Dimension', 'Design View', 'Drill Table' , 'Embedded Board', 'Fill', 'Layer Stack Table', 'Leader Dimension', 'Linear Diameter Dimension', 'Linear Dimension', 'OLE Object', 'Original Dimension', 'Pad', 'Poly', 'Radial Diameter Dimension', 'Radial Dimension', 'Region', 'Split Plane', 'Text', 'Track', 'Via'.
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Design Rules – 次の文字列は各種ルールタイプを対象にするために使用されます。文字列の後ろの括弧内には、PCB Rules and Constraints Editor ダイアログに表示されるルールタイプ名を示します：
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'Acute Angle Rule'(Acute Angle)
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'Bare-board Fabrication Test Point Style Rule'(Fabrication Testpoint Style)
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'Bare-board Fabrication Test Point Usage Rule'(Fabrication Testpoint Usage)
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'Board Outline Clearance'(Board Outline Clearance)
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'Broken Nets Rule'(Un-Routed Net)
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'Clearance Rule'(Clearance)
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'Component Clearance Rule'(Component Clearance)
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'Component Rotations Rule'(Component Orientations)
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'Confinement Constraint Rule'(Room Definition)
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'Daisy Chain Stub Length Rule'(Daisy Chain Stub Length)
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'Differential Pairs Rule'(Differential Pairs Routing)
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'Fanout Control Rule'(Fanout Control)
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'Flight Time Falling Edge Rule'(Flight Time - Falling Edge)
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'Flight Time Rising Edge Rule'(Flight Time - Rising Edge)
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'Hole To Hole Clearance Rule'(Hole To Hole Clearance)
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'In-circuit Assembly Test Point Style Rule'(Assembly Testpoint Style)
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'In-circuit Assembly Test Point Usage Rule'(Assembly Testpoint Usage)
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'Layer Pair Rule'(Layer Pairs)
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'Matched Lengths Rule'(Matched Lengths)
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'Max Min Height Rule'(Height)
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'Max Min Hole Size Rule'(Hole Size)
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'Max Min Impedance Rule'(Impedance)
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'Max Min Length Rule'(Length)
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'Max Min Width Rule'(Width)
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'Max Slope Falling Edge Rule'(Slope - Falling Edge)
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'Max Slope Rising Edge Rule'(Slope - Rising Edge)
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'Max Via Stub Length (BackDrilling rule)' (Max Via Stub Length (Back Drilling))
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'Maximum Via Count Rule'(Maximum Via Count)
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'Minimum Annular Ring Rule'(Minimum Annular Ring)
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'Minimum Solder Mask Sliver Rule'(Minimum Solder Mask Sliver)
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'Modified Polygon'(Modified Polygon)
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'Net Antennae Rule'(Net Antennae)
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'Nets To Ignore Rule'(Nets to Ignore)
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'Overshoot Falling Edge Rule'(Overshoot - Falling Edge)
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'Overshoot Rising Edge Rule'(Overshoot - Rising Edge)
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'Parallel Segment Rule'(Parallel Segment)
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'Paste Mask Expansion Rule'(Paste Mask Expansion)
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'Permitted Layers Rule'(Permitted Layers)
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'Polygon Connect Style Rule'(Polygon Connect Style)
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'Power Plane Clearance Rule'(Power Plane Clearance)
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'Power Plane Connect Style Rule'(Power Plane Connect Style)
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'Routing Corner Style Rule'(Routing Corners)
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'Routing Layers Rule'(Routing Layers)
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'Routing Priority Rule'(Routing Priority)
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'Routing Topology Rule'(Routing Topology)
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'Routing Via Style Rule'(Routing Via Style)
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'Short Circuit Rule'(Short-Circuit)
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'Signal Base Value Rule'(Signal Base Value)
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'Signal Stimulus Rule'(Signal Stimulus)
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'Signal Top Value Rule'(Signal Top Value)
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'Silk To Silk Clearance Rule'(Silk To Silk Clearance)
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'Silk To Solder Mask Clearance Rule'(Silk To Solder Mask Clearance)
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'SMD Entry'(SMD Entry)
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'SMD Neck Down Rule'(SMD Neck-Down)
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'SMD To Corner Rule'(SMD To Corner)
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'SMD To Plane Rule'(SMD To Plane)
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'Solder Mask Expansion Rule'(Solder Mask Expansion)
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'Supply Nets Rule'(Supply Nets)
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'Unconnected Pin Rule'(Un-Connected Pin)
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'Undershoot Falling Edge Rule'(Undershoot - Falling Edge)
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'Undershoot Rising Edge Rule'(Undershoot - Rising Edge)
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'Vias Under SMD Rule'(Vias Under SMD)
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Others – 'Board Region', 'Class', 'Differential Pair', 'Net', 'Violation'.
使用例
IsObjectKind('Via')
IsObjectKind('Via') = True
IsObjectKind('Via') = 'True'
すべてのビアオブジェクトを返します。
Not IsObjectKind('Track')
IsObjectKind('Track') = False
IsObjectKind('Track') = 'False'
トラックオブジェクトを除く、すべてのオブジェクトを返します。
注記
ObjectType 文字列の先頭と末尾にあるシングルクォート（'）は必須です。
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